Process for preparing bead polymers with an average particle size in the range from 1 to 40 .mu.M, moulding compositions comprising bead polymer, and mouldings and PAMA plastisols

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United States of America Patent

PATENT NO 6809163
APP PUB NO 20020123563A1
SERIAL NO

10029289

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Abstract

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The present invention provides a process for preparing bead polymers having an average particle size of 1 to 40 .mu.m, which includes: contacting: at least one polymerizable mix which includes at least 50% by weight of at least one (meth)acrylate monomer, at least one aluminum compound, and an aqueous phase, to prepare a mixture; dispersing the mixture at a shear rate.gtoreq.10.sup.3 s.sup.-1 to form a dispersion, wherein the dispersion is stabilized by the aluminum compound; and polymerizing to produce bead polymers having an average particle size of 1 to 40 .mu.m.

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Patent Owner(s)

Patent OwnerAddress
EVONIK OPERATIONS GMBHRELLINGHAUSER STRASSE 1-11 ESSEN 45128

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Belzner, Winfried Gruendau, DE 7 76
Parusel, Markus Messel, DE 19 159
Schmitt, Guenter Darmstadt, DE 29 333
Schultes, Klaus Wiesbaden, DE 58 914
Suefke, Thomas Erzhausen, DE 17 387

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