Semiconductor device having leads provided with interrupter for molten resin
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 19, 2004
Grant Date -
Feb 6, 2003
app pub date -
Jul 16, 2002
filing date -
Jul 17, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device includes semiconductor elements, a housing for accommodating the semiconductor elements, a resin material arranged in the housing for enclosing the semiconductor elements, and leads connected to the semiconductor elements. Each lead is divided into two portions, that is, an inner portion embedded in the resin material and an outer portion protruding from the resin material. The outer portion of the lead is provided with an enlarged part having a barrier surface directed toward the resin material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully