Method of manufacturing a printed wiring board having a non-through mounting hole
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United States of America Patent
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Oct 12, 2004
Grant Date -
Jan 16, 2003
app pub date -
Jul 10, 2002
filing date -
Jul 10, 2001
priority date (Note) -
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Abstract
A method of manufacturing a printed wiring board, enabling insertion components to be mounted on both sides thereof, including: a) providing first and second copper-clad laminates, including plated through-holes thereon; b) hot-pressing the laminates with each other and a first prepreg bonding sheet therebetween, so that the through-holes are closed by the prepreg to form non-through holes; c) laminating a second prepreg on each of the surfaces of the composite laminate; d) covering the opening of respective non-through holes with a heat resistant resin film; e) laminating one-side copper-clad laminate on each of the surfaces of the product of (d), with the copper side out, followed by hot-pressing; f) etching the copper sides to form outer layer circuit patterns; g) removing the base material layers covering the openings of the non-through holes; and h) removing the heat resistant resin films of the openings of the non-through holes.
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