Copper plating bath and plating method for substrate using the copper plating bath
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United States of America Patent
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Oct 5, 2004
Grant Date -
Jun 12, 2003
app pub date -
May 9, 2002
filing date -
May 9, 2001
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Abstract
A copper plating bath comprising a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate, and a plating method using this copper plating bath are disclosed. A copper plating bath capable of providing highly reliable copper plating on a substrate such as a silicone wafer semiconductor substrate or printed board having minute circuit patterns and small holes such as blind via-holes, through-holes, and the like, and a method of copper plating using the copper plating bath can be provided.
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