System and method for utilization of waste heat of semiconductor equipment and heat exchanger used for utilization of waste heat of semiconductor equipment
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United States of America Patent
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Oct 5, 2004
Grant Date -
Apr 22, 2004
app pub date -
Aug 19, 2003
filing date -
Feb 20, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An amount of energy consumption in a semiconductor fabrication facility can be reduced by using cooling water drained from a semiconductor fabrication apparatus as a heat source of another semiconductor fabrication apparatus. Cooling water of 80.degree. C. drained from a heating furnace of a heat processing apparatus (10) is supplied to a deionized water heating apparatus (32) of a cleaning apparatus (30). The deionized water heating apparatus (32) raises a temperature of deionized water of a room temperature to 60.degree. C. through heat exchange with the cooling water of 80.degree. C. The cooling water, whose temperature falls to 30.degree. C. after the heat exchange, is reutilized for cooling of the heating furnace (12).
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