Flame-retardant epoxy resin composition, molded article thereof, and electronic part

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6797750
APP PUB NO 20030114606A1
SERIAL NO

10221813

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention has an object to provide a flame-retardant epoxy resin composition excellent in heat resistance and moisture resistance. A flame-retardant epoxy resin composition relating to the present invention contains an epoxy resin (A), a phosphazene compound (B), an epoxy hardener (C) and an inorganic filler (D), wherein the phosphazene compound (B) and the epoxy hardener (C) are included in the range of 0.01 to 70% by weight and in the range of 0 to 70% by weight, respectively, relative to a total quantity of the epoxy resin (A), the phosphazene compound (B) and the epoxy hardener (C), and the inorganic filler (D) is included in the range of 0 to 95% by weight relative to a total quantity of the epoxy resin (A), the phosphazene compound (B), the epoxy hardener (C) and the inorganic filler (D), wherein the phosphazene compound (B) is at least one selected from the group consisting of (1) a cyclic and/or a chain phosphazene compound with a specific structure, (2) a polymer of the cyclic and/or the chain phosphazene compound; and (3) a reaction product of the cyclic and/or the chain phosphazene compound with one type of a compound selected from the group consisting of an epoxy compound, a phenol compound, an amine compound and an acid anhydride.

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Patent Owner(s)

Patent OwnerAddress
OTSUKA KAGAKU KABUSHIKI KAISHAOSAKA-SHI OSAKA-FU 540-0021

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nishioka, Yoichi Tokushima, JP 20 396
Tada, Yuji Tokushima, JP 33 377
Taniguchi, Masatoshi Osaka, JP 33 219

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