Method of polishing copper layer of substrate
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United States of America Patent
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Sep 28, 2004
Grant Date -
Jul 3, 2003
app pub date -
Dec 27, 2002
filing date -
Dec 28, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.
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