Fabrication method of semiconductor integrated circuit device
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United States of America Patent
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Sep 28, 2004
Grant Date -
Aug 14, 2003
app pub date -
Feb 12, 2003
filing date -
Feb 14, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
At the time of performing resin molding for a matrix frame in the fabrication of semiconductor integrated circuit devices, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, so as to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities, while the pressure therein is regulated in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of the product being obtained.
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