Method and device for producing a soldered joint
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United States of America Patent
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Sep 28, 2004
Grant Date -
N/A
app pub date -
May 6, 2002
filing date -
Nov 8, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the solder material arranged on the solder material carrier. At least one component is heated in a melt chamber (12) in a process atmosphere which is sealed off from the environment. In a subsequent step the component is cooled in a cooling chamber (13) in a process atmosphere which is sealed off from the environment. The component is heated and cooled in process chamber (12, 13) which are independent of each other.
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