RELIABILITY OF HEAT SINK MOUNTED LASER DIODE BARS
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United States of America Patent
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Sep 28, 2004
Grant Date -
Oct 7, 2004
app pub date -
Apr 3, 2003
filing date -
Apr 3, 2003
priority date (Note) -
Granted
status (Latency Note)
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Abstract
A laser diode bar, solder preform and heat sink are assembled prior to reflowing the solder in a manner to prevent molten solder from being drawn by capillary action over the light emitting end of the diode bar. A recessed pin 30 locates the ends of the laser bar and solder preform with respect to an edge of the heat sink so that the laser bar and solder preform overhang the heat sink edge by respective amounts. When molten, the solder will not be drawn by capillary action to obscure the light emitting end of the laser diode bar.
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