Heating furnace and semiconductor wafer-holding jig assembly and process of manufacturing semiconductor devices
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United States of America Patent
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Sep 21, 2004
Grant Date -
Feb 13, 2003
app pub date -
Jul 25, 2002
filing date -
Jul 26, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An assembly of heating furnace and semiconductor wafer-holding jig. This assembly includes a furnace body made of refractory or heat insulting material; a heater disposed around the inner side surface of the furnace body; a reaction chamber which forms a uniform heating zone; and a wafer-holding jig. The wafer-holding jig is capable of holding the wafer and advancing and retracting the wafer in the uniform heating region along the longitudinal direction of the furnace body. The front surface of the semiconductor wafer to be heat-treated is substantially in parallel with the surface of the heater. The assembly of the invention can be used in rapid thermal processing and the footprint of the heating furnace can be reduced.
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