Testing of BGA and other CSP packages using probing techniques

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United States of America Patent

PATENT NO 6791346
SERIAL NO

10140573

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Abstract

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A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

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Patent Owner(s)

Patent OwnerAddress
STATS CHIPPAC PTE LTD5 YISHUN STREET 23 WASHINGTON DC 20006

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Camenforte, Raymundo M Singapore, SG 17 178
Mehta, Rajiv Singapore, SG 6 289
Tan, Chee-Keong Singapore, SG 9 47
Yap, Liop-Jin Singapore, SG 5 47

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