Method and apparatus for bonding substrate plates together through gap-forming sealer material

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6790300
APP PUB NO 20020043344A1
SERIAL NO

09951512

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Abstract

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Method and apparatus for registering and bonding upper and lower substrate plates together through a sealer material and in such a way as to form a gap of a predetermined width between the two substrate plates. Registered substrate plates are provisionally pressed to form a joined substrate assembly, which is then pressed under heated conditions at a hot press station, thereby compressing the sealer material into a flattened form and at the same time thermally hardening the sealer material to form a predetermined gap space between the two substrate plates. In order to correct positional deviations which occur to the upper and lower substrate plates in the course of the hot pressing, on the basis detected positional deviations of upper and lower substrate plates of a hot-pressed substrate assembly, upper and lower substrates are set in offset positions instead of aligned positions when registering them at the provisional press station to cancel predicted positional deviations at the hot press station.

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Patent Owner(s)

Patent OwnerAddress
HITACHI ELECTRONICS ENGINEERING CO LTDSHIBUYA-KU TOKYO 150

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichikawa, Hisayoshi Ashigara, JP 13 113
Kiyomiya, Hiroaki Yokohama, JP 1 5
Otsubo, Yuji Isehara, JP 4 10
Sugizaki, Shinji Odawara, JP 2 14
Watanabe, Hiroyuki Odawara, JP 670 6656

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