Semiconductor resin molding method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 7, 2004
Grant Date -
Feb 21, 2002
app pub date -
Jun 25, 2001
filing date -
Jun 26, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A resin tape substrate with a semiconductor chip mounted thereon is put to an attachment area surface of a cavity bottom surface, and a plurality of suction holes connected to a suction system are disposed in the attachment area surface, wherein the attachment area surface of the cavity is formed in a semiconductor resin mold, so that the molten resin given into the cavity does not flow into the back surface of the resin tape substrate which is sucked on the attachment area surface in the mold.
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