Epoxy resin bonding pad for a ceramic orthodontic appliance
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United States of America Patent
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Sep 7, 2004
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N/A
app pub date -
Apr 10, 2002
filing date -
Apr 10, 2002
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Abstract
A light-curable methacrylate based epoxy resin bonding pad molded to a ceramic orthodontic appliance, wherein the epoxy resin is made of bisphenol glycidyl methacrylate, tetra-hydrofurfuryl methacrylate, titanium dioxide, and camphor quinone, and the invisible light transmittance through the appliance and the pad is on the order of five percent plus or minus two percent.
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