Drop amplifier housing with multiple tiers
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United States of America Patent
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-
Aug 24, 2004
Grant Date -
Dec 4, 2003
app pub date -
May 31, 2002
filing date -
May 31, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
An amplifier housing assembly is disclosed. The housing assembly includes a first section including a first plurality of holes; and a second section including a second plurality of holes. The first and second sections are interconnected. The first and second sections have a common back wall and a common bottom plate. The first plurality of holes and the second plurality of holes are at two different parallel planes.
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