Semiconductor device having electrodes containing at least copper nickel phosphorous and tin
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United States of America Patent
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Aug 24, 2004
Grant Date -
Jan 30, 2003
app pub date -
Jun 19, 2002
filing date -
Jul 25, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
By a solder bump, a CSP is bonded to a first electrode of the module substrate of a multi-chip module. For this solder bump, a solder added with an alkaline earth metal such as Ba, Be, Ca or Mg is used. Accordingly, upon solder reflow, phosphorous (P) reacts with the alkaline earth metal, thereby forming a P compound. Owing to dispersion of this P compound inside of the solder bump, no P concentrated layer is formed on the Ni film, making it possible to prevent peeling of the solder bump from the first electrode upon solder reflow. Thus, the present invention makes it possible to improve the solder bonding property.
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