Semiconductor component in a wafer assembly
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United States of America Patent
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Aug 24, 2004
Grant Date -
Dec 26, 2002
app pub date -
Jun 21, 2002
filing date -
Jun 22, 2001
priority date (Note) -
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Abstract
Semiconductor components in a wafer assembly, in which the components are connected to a frame by means of in each case one holder and are formed from the same silicon wafer. The holder connects the respective component to the frame on one side and has a desired breaking point. The desired breaking point is designed as a V-shaped groove, the surfaces of which form crystal planes. According to the method, the patterning for production of the holder takes place on the wafer back surface, with subsequent wet chemical anisotropic etching of the V-groove. In this way, the holder is produced independently of the processing of the wafer front surface, and when the semiconductor component is removed a defined broken edge is formed without there being any risk of the semiconductor component being damaged.
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