Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers
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United States of America Patent
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Aug 24, 2004
Grant Date -
Oct 23, 2003
app pub date -
Apr 19, 2002
filing date -
Apr 19, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for the chemical-mechanical polishing of surfaces of circular flat workpieces, in particular semi-conductor wafers, comprising a loading and unloading station for the workpieces which includes a carrier which is supported for rotation about a vertical axis and is driven by a rotary driving means into a predetermined rotary position, at least two horizontal loading surfaces on the carrier means facing upwardly. With a transfer means the workpieces can be placed on the loading surfaces or removed therefrom. At least two polishing tables in corresponding polishing stations are provided which are located at the circumference of the carrier means and at least two chucks for the workpieces, the chucks being adapted to be moved along a vertical and a horizontal axis by moving means to align the chuck with a loading surface, to hold and discharge a workpiece and for the transfer of the workpiece as well to the associated polishing station and away therefrom and for the cooperation with the polishing table of the associated polishing station and a control means for the rotary driving means, the actuation means and the moving means.
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