Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 17, 2004
Grant Date -
Feb 28, 2002
app pub date -
Aug 17, 2001
filing date -
Aug 25, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic device is provided which includes a substrate of insulating resin having at least a pair of interior terminal portions on an upper surface thereof, an electronic element mounted on the terminal portions, having at least a pair of electrode terminals thereof, and a member of insulating resin, bonded on the upper surface of said substrate. The frame includes a cavity to store the electronic element. A cover member of insulating material hermetically seals over the cavity. Electrodes are formed at or in vicinity of positions of the terminals of said electronic element to electrically conduct the interior terminal portions for connection outside the device. Alternatively, roughened surfaces can be formed on metal electrode portions, which are formed on the upper surface of substrate for electrically conducting said interior terminal portions to exterior terminal portions.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully