Anisotropic bonding system and method using dynamic feedback
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 17, 2004
Grant Date -
N/A
app pub date -
Nov 27, 2000
filing date -
Nov 27, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An improved anisotropic bonding system and method connects two conductive surfaces together using an anisotropic material having elastic conductive particles dispersed in an insulating, heat-curable carrier. The system monitors bond resistance in real-time during the bonding process and controls the application of pressure to the bond based on a feedback signal corresponding to the bond resistance. When the bond resistance reaches a predetermined value, the applied pressure is reduced to a holding/clamping level to prevent over-compression as the curing schedule completes curing of the insulating carrier. By monitoring and responding to the bond resistance in real time during the bond compression process, the system prevents bond resistance increases caused by over-compression and conductor damage.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully