High-accuracy placement method utilizing double pick and place
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United States of America Patent
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Aug 17, 2004
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app pub date -
Nov 5, 2002
filing date -
Nov 5, 2002
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Abstract
A method is provided for placement of a first workpiece onto a second workpiece. The first workpiece is initially positioned at an origination location and the second workpiece has an attach location different from the origination location. A first place step is performed to displace the first workpiece from the origination location to an intermediate location different from the origination and attach locations. A second place step is performed to displace the first workpiece from the intermediate location to the attach location and the first workpiece is attached to the second workpiece at the attach location.
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