Method and device for thermally treating objects
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United States of America Patent
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Aug 10, 2004
Grant Date -
Sep 4, 2003
app pub date -
Mar 5, 2003
filing date -
Jul 4, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a method and to a device for thermally treating objects. The aim of the invention is to facilitate a better control of the temperature profile of an object to be thermally treated. To this end, the invention provides a method and a device for thermally treating an object in a heating system, especially for treating semiconductor wafers (2) in a rapid heating system (1). The objects are thermally treated at a predetermined temperature progression and the temperature of the object is controlled via a PID control and a feedforward control that are based on a simulation model of the heating system and the object. Said model consists of individual models of components of the heating system and/or the object. The parameters of at least one of the individual models are monitored during the thermal treatment and the model is adapted to the monitored parameters.
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