Package having an opening in a surface thereof for mounting a solid state image sensor
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United States of America Patent
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Aug 10, 2004
Grant Date -
Nov 13, 2003
app pub date -
Apr 30, 2003
filing date -
May 7, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The package for mounting a solid state image sensor is a box-type resin package having in its bottom surface an opening for allowing light to pass so that a solid state image sensor may be mounted face down there. In the package, a three-dimensional circuit is formed which has a lead comprising a conductive metal plate making electrical conductance possible. The top surface of the inner lead of the lead is exposed on the inside bottom surface in the vicinity of the opening, and the top surface of the outer lead and the edge of the lead, following a bent section of the lead, are exposed on the side wall top surface of and the top edges of the side wall side surface of the aforesaid box-type resin package, respectively, with all the parts of the lead other than the exposed parts of both ends being embedded in the resin. Because of this, a small, thin package for mounting a solid state image sensor can be manufactured at low cost by using a simple process.
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