Photosensitive resin composition, patterning method, and electronic components
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United States of America Patent
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Aug 10, 2004
Grant Date -
Jul 25, 2002
app pub date -
Dec 12, 2001
filing date -
Sep 23, 1999
priority date (Note) -
Expired
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Abstract
A photosensitive resin composition comprising an aromatic polyimide precursor, wherein a 35 .mu.m film made by imidating ring closure on a silicon substrate has a light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 MPa. The composition can be patterned through i-line exposure followed by development with alkaline solutions, and can be imidized into low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.
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