Particle board and method of making the same
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United States of America Patent
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Aug 10, 2004
Grant Date -
Aug 1, 2002
app pub date -
Feb 15, 2002
filing date -
Oct 1, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A particle board having wooden materials coated with an adhesive of a thermosetting resin and pressurized with being heated includes a core layer and face layers provided on both, front and back, sides of the core layer. The wooden materials of the face layer are smaller in the average particle diameter than the wooden material of the core layer and voids between the adjacent wooden materials in the face layer and the core layer are filled with resin particles of a thermoplastic resin by being pressurized with being heated.
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