Die used for resin-sealing and molding an electronic component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 10, 2004
Grant Date -
N/A
app pub date -
Nov 2, 2000
filing date -
Nov 9, 1999
priority date (Note) -
Expired
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Abstract
A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.
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