Thermoelectric module and method of assembling the thermoelectric module in a radiating member
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United States of America Patent
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Aug 3, 2004
Grant Date -
Oct 31, 2002
app pub date -
Feb 27, 2002
filing date -
Feb 27, 2001
priority date (Note) -
Expired
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Abstract
A thermoelectric module includes plural thermoelectric semiconductor chips connected in series, first and second substrates, plural first and second electrodes formed on the first and second substrates, first solder through which the first and second electrodes are bonded to end portions of the thermoelectric semiconductor chips. The first substrate includes two or more protrusions protruding toward opposite sides with respect to the second substrate when being viewed vertically. A method of assembling a thermoelectric module in a radiating member includes the steps of mounting the first substrate on a radiating member through the second solder having a liquidus temperature lower than a solidus temperature of the first solder; holding the protrusions by leading edges of support arms where the second solder is melted to push the first substrate toward the radiating member under pressure while rocking the first substrate in a direction orthogonal to the pushing direction.
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