Polyimide copolymer

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United States of America Patent

PATENT NO 6770733
APP PUB NO 20030187179A1
SERIAL NO

10336343

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Abstract

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A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole has a heat-resistant dimensional stability without any deterioration of mechanical properties inherent in the polyimide resin when used as a film.

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Patent Owner(s)

Patent OwnerAddress
NIPPON MEKTRON LIMITEDMINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Jenq-Tain Kitaibaraki, JP 12 35
Zuo, Min Kitaibaraki, JP 6 8

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