Resin composition

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United States of America Patent

PATENT NO 6770709
APP PUB NO 20030125452A1
SERIAL NO

10312619

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a resin composition comprising: (1) a vinyl copolymer obtained from a starting material containing vinyl monomer (a) which comprises at least one carbonyl group or aldehyde group and vinyl monomer (b) which is different from vinyl monomer (a) and capable of copolymerization; (2) a hydrazide derivative represented by general formula (I): ##STR1## (wherein R.sup.1 represents substituted or unsubstituted phenylene, substituted or unsubstituted cyclohexylene or alkylene; and R.sup.2 and R.sup.3, which may be the same or different, each represent a single bond or alkylene) or a hydrazide derivative in which the amino group(s) of the hydrazide derivative represented by general formula (I) are protected with a low molecular carbonyl compound; and (3) a polyamine compound represented by general formula (II): ##STR2## (wherein R.sup.4 represents substituted or unsubstituted phenylene, substituted or unsubstituted cyclohexylene or alkylene; and R.sup.5 and R.sup.6, which may be the same or different, each represent a single bond or alkylene) or the polyamine compound in which the amino group(s) of the polyamine compound represented by general formula (II) are protected with a low molecular carbonyl compound.

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Patent Owner(s)

Patent OwnerAddress
KYOWA YUKA CO LTDTOKYO 100-0004

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hotta, Iwao Yokkaichi, JP 6 32
Konishi, Shohei Tokyo, JP 5 17
Murata, Shigeru Suzuka, JP 40 285
Nakano, Yoshio Yokkaichi, JP 47 790

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