Substrate cutting method
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United States of America Patent
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Aug 3, 2004
Issued Date -
N/A
app pub date -
Feb 20, 2002
filing date -
Feb 21, 2001
priority date (Note) -
Expired
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Abstract
A substrate, such as a semiconductor wafer, is cut without using a dicer or an adhesive sheet. A semiconductor wafer 1 formed with a number of elements 2 is drawn and held by an x-y table 4, and ultrashort pulse laser 7 having a pulse width of not more than 1 picosecond is irradiated along scribed lines between the elements 2 to cut the same.
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