Lightweight semiconductor device and method for its manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 27, 2004
Grant Date -
Jan 29, 2004
app pub date -
Jul 23, 2002
filing date -
Jul 23, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An ultra lightweight semiconductor device comprises a substrate electrode, a body of semiconductor material, and a top electrode, and is manufactured by a process wherein the thickness dimension of a portion of the substrate electrode is decreased so as to reduce the weight of the device. The portions of the device having a thick substrate serve to support and reinforce the device during processing and handling. These portions may subsequently be severed away to further reduce the weight of the device. Also disclosed are configurations of ultra lightweight semiconductor devices.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully