Metallized polyimide film
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 27, 2004
Grant Date -
Aug 7, 2003
app pub date -
Oct 1, 2002
filing date -
Apr 3, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A metallized polyimide film of the present invention comprises a polyimide film 1 which has undergone surface roughening treatment to produce a surface Ra value of 2 to 10 nm, an intermediate layer 2 formed from one, or two or more elements selected from a group consisting of molybdenum, silicon and silicon monoxide, which is formed on top of the surface which has undergone surface roughening treatment with an average thickness of 5 to 50% of the aforementioned Ra value, and a conductive metal layer 4 which is formed on top of the intermediate layer 2. This construction improves the bonding strength between the polyimide film and the metal layer.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully