Integrated circuit bonding device and manufacturing method thereof
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United States of America Patent
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-
Jul 20, 2004
Grant Date -
May 22, 2003
app pub date -
Aug 6, 2002
filing date -
Nov 22, 2001
priority date (Note) -
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Abstract
An integrated circuit device. The substrate includes a signal connection point and two shielding connection points set at the two sides of the signal connection point. The chip is set on the substrate. There are a signal pad and two shielding pads set at the two sides of the signal pad on the edge of the chip. The signal wire bonding is coupled to the signal connection point and the signal pad. Two shielding wire bondings are coupled to the shielding connection points and the shielding pads and extend along both sides of the signal wire bonding. The signal trace line is set on the substrate and coupled to the signal connection point. The power ring circuit is set on the substrate and coupled to the shielding connection points. The power circuit includes two shielding lines extending along both sides of the signal trace line.
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