Micro-relay
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 20, 2004
Grant Date -
N/A
app pub date -
Feb 11, 2002
filing date -
Feb 4, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microstructure relay is provided, having a body that includes upper and lower portions. The lower portion is formed from a substrate, and the upper portion is formed on the substrate to avoid bonding of the lower portion to the upper portion. A support member is fixed to the body at a first end of the support member to form a cantilever, wherein an upper surface of the support member and a lower surface of the upper portion of the body form a cavity. A first contact region is located on the upper surface at a second end of the support member. The first contact region comprises a first contact, wherein pivoting the support member toward the lower surface causes the first contact to be electrically coupled to a counter contact.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully