Circuit board and method of producing the same
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United States of America Patent
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Jul 20, 2004
Grant Date -
Jul 10, 2003
app pub date -
Dec 27, 2002
filing date -
Dec 27, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A circuit board comprising a resin molded article which includes a metal powder coated by an insulation film and a metal conductor which is formed by metal deposition over a circuit pattern drawn by laser beam irradiation on the surface of the resin molded article through electroless plating, and the method of producing the same.
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