Polishing pad composition and method of use
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United States of America Patent
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Jul 20, 2004
Grant Date -
N/A
app pub date -
Aug 22, 2001
filing date -
Mar 6, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is directed, in general, to packaged polishing pads for chemical mechanical polishing of semiconductor wafers and integrated circuits. More specifically, the invention is directed to a method of preparing and packing the pad and the packaging therefor. Prior to placing the pad on a platen and polishing with the pad, a polishing pad having an hygroscopic absorbency is soaked with an aqueous media for a time sufficient to equilibrate the pad. The pad maybe packaged by placement in a sealable moisture tight package after soaking or before soaking along with a sufficient quantity of aqueous media to allow the pad to equilibrate.
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