Control of a multi-chamber carrier head
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United States of America Patent
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Jul 20, 2004
Grant Date -
N/A
app pub date -
Mar 7, 2003
filing date -
Mar 7, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus and method for chemical mechanical polishing in which a substrate is pressed against a polishing pad by a carrier head having a plurality of chambers. A common pressure is applied by the plurality of chambers in the carrier head using a common regulator, but a duration of application of the first pressure to each chamber from the plurality of chambers is controlled independently from other chambers.
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