Power module
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United States of America Patent
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Jul 13, 2004
Issued Date -
N/A
app pub date -
Dec 10, 2002
filing date -
May 16, 2000
priority date (Note) -
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Abstract
A power module includes a substrate with a power semiconductor device mounted thereon, a case having an interior in which the substrate is disposed, a cooling fin having a surface on which the substrate and the case are placed, and a smoothing capacitor disposed on an opposite surface of the cooling fin from the surface on which the substrate is placed, the smoothing capacitor being electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device.
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