Package having array of metal pegs linked by printed circuit lines
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United States of America Patent
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Jul 13, 2004
Grant Date -
Jul 11, 2002
app pub date -
Feb 25, 2002
filing date -
Oct 10, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit package structure having an array of metal pegs connected by printed circuit lines. The package includes a die pad having a die positioned above and an area array distribution of external metal pegs surrounding the die. The package also contains a plurality of internal metal pegs that surround the die. These internal pegs are electrically connected to the bonding pads on the die via conductive medium. The die pad, the die, the conductive medium and the internal pegs are all enclosed by an insulating material. The bottom side of the die pad is exposed while the external metal pegs are electrically connected to various internal metal pegs using printed circuit lines. Furthermore, an electroplate layer is also formed on the end face of each metal peg.
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