Lead frame for a semiconductor device and a semiconductor device incorporating the lead frame
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United States of America Patent
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Jun 29, 2004
Grant Date -
Aug 21, 2003
app pub date -
Dec 18, 2002
filing date -
Dec 19, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A lead frame for a semiconductor device. The lead frame has opposite first and second sides bounded respectively by first and second parallel reference planes between which a thickness is defined. The lead frame has a support with a surface at the first side of the lead frame for receiving a semiconductor chip. A plurality of leads are spaced from the support to be electrically connected to a semiconductor chip on the support. A first lead in the plurality of leads has a length between first and second ends and a width taken transversely to the length. The first end of the first lead has a first region that has a thickness less than the thickness of the first lead at the second end of the first lead so that at least a part of the first region is offset from the second reference plane toward the first reference plane. The first end of the first lead has at least a first protrusion projecting away from the first reference plane.
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