Process for manufacturing a housing for sensor elements, sensor and use thereof
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United States of America Patent
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Jun 29, 2004
Grant Date -
Sep 12, 2002
app pub date -
Mar 8, 2002
filing date -
Mar 9, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
For manufacturing a housing for sensor elements, a pliable material is introduced into the environment of the sensor element (2) by an injection molding process. In a first process step, the sensor element is injection-encapsulated by a soft plastic component (1), and in a second process step a hard plastic component (5) is applied thereon, which forms the outer housing for the sensor element (2). The sensor element (2) is provided with at least two connection leads (11), which are at least partially encapsulated by the soft plastic component (1). A sensor manufactured according to the process, especially a temperature sensor, is provided with a measuring resistor as a sensor element (2) on a substrate with an electrically conducting surface and the resistance layer situated thereon. The measuring resistor is encased by the soft plastic component (1), which in turn is encapsulated in a hard plastic component serving as a housing.
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