Shockproof mechanism, in particular for use in space sector
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United States of America Patent
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Jun 29, 2004
Grant Date -
N/A
app pub date -
Sep 4, 2002
filing date -
Nov 30, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention concerns a device forming a mechanism, in particular for use in the space sector, characterised in that it comprises in combination: a material (300) with low melting point capable of producing a soldering joint, at least heating means (400), a structure having an architecture with a zone blocked by the low melting point material (300), capable of being released by liquefying the low melting point material, and means for forced rolling of the low melting point metal (300) in liquid state, after the heating means (400) have been activated, to produce a shock absorbing function.
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