Printed circuit board having jumper lines and the method for making said printed circuit board
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United States of America Patent
Stats
-
Jun 22, 2004
Grant Date -
May 8, 2003
app pub date -
Nov 7, 2001
filing date -
Nov 7, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates a printed circuit board having jumper lines, and a method for making the printed circuit board. An isolation layer made of a dielectric material is coated on the line layer of the printed circuit board, and multiple pads are formed in the isolation layer, thereby exposing part of the line layer without covered by the isolation layer. A high conductive material is coated on the isolation layer to connect the multiple pads, thereby forming a planar jumper layer that is connected to the line layer through the circular pads. Thus, the planar jumper layer may be made simultaneously during fabrication of the printed circuit board, without having to perform the wire-bonding work.
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