Method and apparatus for cutting a substrate using laser irradiation
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United States of America Patent
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Jun 22, 2004
Issued Date -
N/A
app pub date -
Feb 19, 2002
filing date -
Jul 6, 2001
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Expired
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Abstract
The invention relates to a method and apparatus for cutting a substrate using laser irradiation. A laser beam is scanned over a substrate. The beam ablates a first layer of the substrate. The beam is then refocused onto the newly revealed second layer and a further pass is performed. The process is repeated until complete separation occurs. The method and apparatus are particularly suitable for singulation of IC packages.
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