Printed circuit board having permanent solder mask
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United States of America Patent
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-
Jun 22, 2004
Grant Date -
Apr 17, 2003
app pub date -
May 24, 2002
filing date -
Oct 12, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board having a permanent solder mask includes a substrate made of a glassfiber reinforced epoxy resin material. The top and bottom surfaces of the substrate are disposed thereon a conductive pattern respectively. An epoxy resin solder mask is coated on each surface of the substrate in such a way that the conductive pattern is divided into a sheltered portion covered by the solder mask and an unsheltered portion exposed outside. The solder mask also has an even and smooth outer surface with a micro-roughness ranging between 0.5 .mu.m.about.10 .mu.m and an optimum thickness ranging between 2 .mu.m.about.200 .mu.m.
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