Method and apparatus device for the heat treatment of substrates
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United States of America Patent
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Jun 22, 2004
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app pub date -
Nov 13, 2000
filing date -
May 11, 1998
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Abstract
The invention relates to a device and a method for the heat treatment of substrates, especially semiconductor wafers. The device comprises a reaction chamber with a compensation element. According to the invention the substrate can be inserted and withdrawn again more easily by the fact that the compensation element (15) can be at least partly lowered and/or raised in the reaction chamber.
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