Thermoforming method for film on blister packing machines and apparatus for it
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United States of America Patent
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Jun 15, 2004
Grant Date -
Mar 20, 2003
app pub date -
Aug 30, 2002
filing date -
Sep 19, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present provides a thermoforming system for film on blister packing machines that forms pockets without any extreme reduction of thickness of the sheet at the top face portion of the pocket and enables sheets to be placed one upon another without warping. The thermoforming system for film for blister packaging machines pinches and heats a film, fed intermittently in synchronization with an open/close drive of a pair of dies on a thermoforming system, between the dies of the thermoforming system, and partially extends the heated film along an inner circumferential face of the pocket holes of the forming die to form pockets. The dies of the thermoforming system are constructed with a forming die provided with pocket holes, a heating die provided with a plugs for locally heating only the pocket forming portion of the film F disposed facing the pocket holes of the forming die, and injecting mechanisms that inject compressed air disposed on the forming die side and the heating die side, respectively.
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