System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector
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United States of America Patent
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Jun 8, 2004
Grant Date -
N/A
app pub date -
Jul 17, 2000
filing date -
Jul 17, 2000
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Abstract
A system and method for providing high voltage resistance capability in a receptacle apparatus for accepting a high-density compliant pin connector. A plurality of high-density compliant pin through-holes are formed in a printed circuit board for receiving the pins of the high-density compliant pin connector. The through-holes are plated using an electrically conductive material, whereby conductive pads are formed around the plated through-holes on at least one side of the printed circuit board. Thereafter, the conductive pads around the plated through-holes on the printed circuit board are removed by controlled depth back-drilling so as to increase the inter-pad clearance of the through-holes for withstanding foreign voltages.
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