Flip chip package structure
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United States of America Patent
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Jun 8, 2004
Grant Date -
N/A
app pub date -
Jun 6, 2003
filing date -
Jun 6, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A flip chip package structure. The structure includes a substrate, an IC chip electrically connected to the substrate through a plurality of conductive bumps, encapsulant between the substrate and IC chip, and an electrically protective device. The substrate has interior wiring, a plurality of first contacts arranged at a predetermined pitch among each other on a surface, and a trace line area beyond the first contacts on the surface. The electrically protective device has a protruding part covering the IC chip, and an extending part extending over the surface of the substrate with a gap as large as 40 mil. The extending part further covers the trace line area, and connects to the surface of the substrate using a fixing material.
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